In this free application note, discover how to streamline the routine analysis of CMP slurry additives using the Waters Arc HPLC system
Chemical mechanical polishing (CMP) or planarization slurries are used in the semiconductor industry to create a specific surface on a silicon wafer in the construction of various electronics. To maintain the quality of the slurry, many chemical additives are used. The routine analysis of additives in a CMP slurry can be helpful in formulation or quality control.
Using a fifteen-minute separation method, the Waters Arc High Performance Liquid Chromatography (HPLC) system with Photodiode Array (PDA) and ACQUITY QDa Mass Detection (MS) can be used for analysis of a CMP slurry and for individual additives or mixtures of additives in a quantitative analysis for those easily detected by PDA, and a qualitative analysis for those more challenging additives that require mass detection.
In this free application note: