Additive quantification in a commercial CMP sample

Silicon Wafer with microchips used in electronics for the fabrication of integrated circuits

Source: © Shutterstock

In this free application note, discover how to streamline the routine analysis of CMP slurry additives using the Waters Arc HPLC system 

Waters Arc HPLC

Chemical mechanical polishing (CMP) or planarization slurries are used in the semiconductor industry to create a specific surface on a silicon wafer in the construction of various electronics. To maintain the quality of the slurry, many chemical additives are used. The routine analysis of additives in a CMP slurry can be helpful in formulation or quality control.

Using a fifteen-minute separation method, the Waters Arc High Performance Liquid Chromatography (HPLC) system with Photodiode Array (PDA) and ACQUITY QDa Mass Detection (MS) can be used for analysis of a CMP slurry and for individual additives or mixtures of additives in a quantitative analysis for those easily detected by PDA, and a qualitative analysis for those more challenging additives that require mass detection.

In this free application note:

  • Learn how the Arc HPLC system can rapidly quantify additives without re-validation
  • Discover the robust XBridge BEH columns that are capable of low and high-pressure applications without compromising the column bed
  • Find out how ACQUITY QDa Mass Detection can give you more confidence in your results
  • Explore the Empower 3 Chromatography Data System (CDS) for data analysis of PDA, QDa, and all Waters Arc HPLC compatible detectors